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The LaserSharp® laser processing offers manufactures of electronic components precision laser cut features registered to print in sheet or roll feed applications. LasX specializes in offering both laser contract production and equipment for processing electronic components.
Applications:
- Graphic Overlays
- Flexible Circuits
- ZIF (Zero Insertion Force) Tails
- Touch Screens
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- ITO
- EL Lamps
- Via Hole Drilling
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Specific Application Advantages:
- Spacers – Our Laser processing eliminates the tedious secondary operation of removing die-cut slugs from spacers. Delays and hassles from adhesive build up on hard tooling dies are eliminated with the LaserSharp® high speed laser processing.
- Zero Insertion Force (ZIF) tails – precision laser processing offers accuracy not available with hard tooling solutions, the ZIF tail sample below was excised with the tail size and location accurate to ± 0.002”, typically a production headache with hard tooling.
- Metalization Removal – polyester with a metalized coating, such as ITO polyester can be selectively removed using LaserSharp® technology without damage to the ITO coating.
Via Hole Drilling – the LaserSharp® via hole drilling software produces consistent via holes for use in double-sided polyester flexible circuits. The 3 hole via configuration as shown, produces 0.010” diameter via holes resulting in problem free interconnects when screen printed.
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