LasX

		Electrodes can be part of an assembly for an IVD device or can be the actual test device adhered to a patient to perform various tests.
		Via Drilling for double sided circuits works well populating large areas with a non-contact method of processing. The via size can be down to a 125µm to allow for smaller pad sizes.
		Flex circuits can be processed with vias for double sided circuits and then excised to high tolerances for registration to print and size especially when critical in the tail areas.
		Coating Ablation to create micro circuits in materials such as ITO and IZO work well using digital converting to remove the metallic substrate to the polymer carrier.

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LasX Industries
www.lasx.com
4817 White Bear Parkway
St. Paul, MN 55110
t: 651-407-0011
f: 651-407-0110