Laser Process Capabilities

Our multiple laser processing capabilities save you time while increasing productivity and throughput.

Process development at LasX is considered a partnership and our team is dedicated to working cooperatively with you to achieve your goals: we’ll suggest processing improvements, laser equipment, and laser-friendly materials to enable the best possible solution for the digital converting of your parts with a processing window designed for your manufacturing environment. LasX creates processes and systems that combine multiple digital converting applications in one system, noticeably increasing your productivity. Available laser process capabilities include:

• Laser Through Cut: To laser cut a material through all layers or components. Learn more.
• Common applications: printed graphic art materials, folding cartons, medical device components, graphic overlays and other industrial components.

 

• Laser Ablate: A dry, non-contact, digital, single step process that removes the top layer of two materials that have been bonded together using a laser beam. Learn more.
• Common applications: isolated circuit traces for medical biosensors, solar panels, RFIDs and flexible displays.

 

• Laser Etch:  The laser beam is used to partially remove material from a homogeneous substrate at a specific depth (without completely penetrating all layers) in order to create a three-dimensional pattern in it. Learn more.
• Common applications: Product identification, instructions, serial numbers, or anti-counterfeit features etched in plastics, plastics, and acrylics; electronic components and circuits to replace chemical etching.

 

• Laser Perforate: To vaporize a series of small, uniform holes in a material. Learn more.
• Common applications: breathable or modified atmosphere flexible packaging, microwavable features, venting for rapid filling or package palletization, decorative elements in paper pieces, and tear lines for easy separation of parts.

 

• Laser Score: By precisely monitoring the depth of a cut, the top and/or internal layer(s) of a material is removed, typically to allow for easier folding or tearing along the score line. Learn more.
• Common applications: fold lines in paper greeting cards, folding cartons, invitations, or brochures, and easy-open tear strips and windows in flexible packaging films.

 

• Laser Kiss-Cut: To cut the top layer of self-adhesive paper without penetrating its backing or liner, resulting in the easy removal of the top layer from bottom release liner.
• Common applications: Labels, stickers, microfluidic subassemblies, spacers.

 

• Laser Via Hole drilling: To create a small opening in a substrate that allows for a conductive connection between different layers.
• Common applications: printed circuit boards and medical electronic components.

Depending on application and material type, different laser sources may be used to perform each process capability:

• CO₂: Most common laser source for multiple process capabilities. Best suited for processing non-metallic materials such as plastics, papers, polymers, textiles, foams, and adhesives. Common applications include those for paper and print, flexible packaging, and industrial markets.

 

• Fiber: Ideally suited for the ablation of thick conductive coatings. Also capable of metal and plastic welding. Common applications include electronic or medical components.

 

• UV: Ideal for the fine ablation of very thin (<1 μm) conductive coatings or thin nonconductive coatings. Common applications include electronic components, biosensors, and precise electrode patterns.

Click here to learn more about laser sources, modules and configurations used in LaserSharp® laser processing systems.

Suitable Materials for Laser Processing:

Our process development team will work with you to develop a laser process to suite your unique applications and materials. Contact us to test your material today.