Medical Electronic Components

 

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Create precise via holes and electrodes for medical electronic components with laser drilling and ablation.

 

Whether it’s high-speed drilling of via holes for double-sided circuits or through–cutting of unique or complex shapes, LasX can assist you with making your design goals into finished components. Let us help you reduce your product redesigns and eliminate performance concessions.

 

Lasers give you unique process capabilities for the production of high performance polyester flexible circuits for the medical diagnostics market.

 

  • Our LaserSharp® capable workstations digitally convert flexible circuits in web and sheet printed formats. Vision systems accurately locate printed registration marks and adjust the cut-line placement in multiple axes for precise print to cut registration. The vision system is invaluable for accurate registration of close pitch connector tails found in today’s high performance flexible circuits.
  • Our LaserSharp® capable systems incorporate proprietary via drilling software for accurate placement and consistent profile of via holes down to 125 µm for trouble-free printing of conductive inks. Since via holes are produced before screen-printing, it is also necessary to place registration marks during the digital converting process. Our LaserSharp® technology produces registration marks that are consistently located by the screen-printing registration sensors.
  • Our LaserSharp® ablation systems create electrodes for medical electronic component assemblies for IVD and biosensor devices. Our laser ablation processes create micro-circuits in thin film conductive materials by removing metallic substrates attached to polymer carriers.

Due to their unique capabilities, lasers are ideal for converting adhesive materials that are problematic with hard tooling. Our non-contact LaserSharp® technology controls adhesive flow and build-up and can consistently remove slugs for better part quality and productivity. Whether your material is medical tape, adhesive laminates, conductive inks, or nearly any other non-metallic material used in the medical device industry, you can process it at LasX in either roll or sheet formats.



 

Close-up of via holes insuring a problem free interconnects when screen printed.

 

Conductive coating of a thin film removed by laser ablation for creating isolated circuits.

 

Close-up of channels created by laser cutting layers of a biosensor subassembly.

 

Laser drilled via holes for screen printing double-sided flexible circuits.

 

 

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Via Holes
Isolated Circuits
Biosensor Subassembly
Double-sided Flexible Circuits