Capabilities

Eleven processes, one beam

What separates these is not the equipment — it is how much energy goes into the material, how fast, and how deep. Cutting, scoring, kiss-cutting, and ablating differ by where the process is told to stop.

Cutting

Through-cutting and kiss-cutting without tooling, on materials that mechanical cutting distorts.

Perforating

Micro-hole patterns for breathable packaging, controlled-atmosphere structures, and tear initiation.

Scoring

Depth-controlled scores for easy-open features, in register, at line speed.

Marking

LaserSharp® high-speed, high-resolution marking applied directly to packaging — no ink, no label, no consumable.

Micromachining

Features to 25 µm in films, foils, and device components — including femtosecond processing where heat cannot be tolerated.

Ablating

Selective removal of one layer without touching the one beneath — coatings, metallization, inks, and electrode material, in register.

Drilling

Micro-holes at controlled diameter and taper — vents, vias, filters, and flow features in films, foils, and thin metals.

Etching

Surface texturing and shallow patterning — bond-ready surfaces, controlled roughness, and functional textures without masks or chemistry.

▶ Video

Welding

Micro-joining of thin metals and polymers — low heat input, no filler, no contact.

Kiss-cutting

Cut the face stock, leave the liner — labels, tapes, gaskets, and medical components released from a carrier, without a die.

Polishing

Shallow remelting that smooths a metal surface without removing material — castings, tool steel, and printed metal parts.