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LasX — The Laser Experts
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Capability

Laser Drilling

Laser drilling produces holes by percussion or trepanning, from tens of microns upward. Optics and pulse parameters set diameter and taper, not a bit. It suits vents in device housings, vias in flexible circuits, filters, and metered-flow features in medical disposables.

How it works

Percussion drilling stacks pulses at one point until breakthrough. Trepanning traces the hole outline with a focused spot, for larger or tighter-tolerance holes. The material and the heat-affected zone the application tolerates decide the source, NIR or UV. They also decide the pulse duration, nanosecond through femtosecond. The two choices are independent.

Why pulse duration sets the edge — the guide and heat-confinement map →

Process envelope

Hole diameterFrom ~20 µmMaterial- and thickness-dependent; trial data required.
MethodPercussion or trepanning
SourcesNIR, UV; nanosecond to femtosecond
Heat-affected zoneMinimal with ultrashort pulses

Drilling is where burr matters most. A mechanical hole in thin metal carries a burr on the exit side, and in a fastener, a filter, or a fluidic channel that burr is a defect. A laser hole carries no mechanical exit burr. We measure exit-edge condition, taper, and recast on your holes and report them.

From the lab

3D height map of a round through-hole laser-drilled in a silicon wafer
A through-hole drilled in a 525 µm silicon wafer with a UV femtosecond laser: exit about 0.5 mm, wall angle about 86°. 3D surface scan of one LasX sample.
Ask us for application photos on your material.

See it run

Cutting and drilling on SheetPro — Micro-holes and cut features produced on a flatbed workstation from sheet material and discrete parts.
Want to see it on your material? Send a sample and we will run it in the lab and send the footage back.