Industry
LasX laser-cuts and kiss-cuts the consumables semiconductor production runs on — process tapes, die attach film, thermal interface pads, electromagnetic interference (EMI) shielding films, adhesive gaskets and release liners — roll-to-roll and toolless, as equipment or contract manufacturing. For glass, silicon and wide-bandgap substrates, LasX develops scanner-based femtosecond processes for through-glass vias, scribing and thin-film ablation on ExactPro. The work starts where the wafer or panel leaves the fab and needs a hole, a scribe, or a pattern that a saw or a mask cannot make.
Applications
Adhesive cut to shape and left on its liner, the same construction as process tapes and die attach film. Kiss-cut depth is controlled digitally, and features run to 25 µm with NIR or shorter wavelengths and 50 µm in CO₂ production.
300 µm vias on a 450 µm pitch, laser-drilled in glass in the PhotonX lab (2026). Diameter and pitch hold within a few microns of nominal; taper and sidewall condition are the development targets. Feature metrology comes in a written report.
Scribing and singulation of glass, silicon, silicon carbide (SiC) and gallium nitride (GaN). Ultrashort pulses keep the heat-affected zone (HAZ) and micro-cracking down.
Patterns in thin films on dielectrics that a saw or a mask cannot make.
Dicing and back-grind tapes, die attach film, thermal pads and shielding films are multilayer webs cut to shape in short runs. A laser cuts and kiss-cuts them with no die, so a design change is a file change and a prototype ships without tooling lead time.
Wavelength, burst regime, fluence, and scan strategy are chosen on your actual material in the PhotonX lab, with feature metrology and HAZ characterization in a written report. The trial produces the starting recipe and process record for the workstation you buy, or for our floor while your volumes grow.
Chiplets, high-bandwidth memory, and 3D heterogeneous integration are moving substrates to glass and to thicker panels. Through-glass vias, glass-core drilling, and crack-free singulation are laser jobs — scanner-based femtosecond jobs — and they sit alongside lithography, not in place of it. A femtosecond pulse removes material before heat spreads, which is what keeps the heat-affected zone and micro-cracking down in glass, SiC, and GaN. Proton λ controls pulse output at 10 ns timing resolution, and pulse-on-demand is designed to hold pitch and energy through acceleration and micro-vectors; achieved placement is measured on the substrate in the trial. These processes are in development in the PhotonX lab, with trial data reported per substrate.
LaserSharp® Modules and MicroLam™ cut and kiss-cut tapes, films and adhesive stacks on a moving web, with no die to buy, store or wear out. ExactPro runs wafer, panel, and substrate work — wafers to 300 mm and 310 mm panel-level packages, with 510 × 515 mm glass interposer and 600 × 600 mm panel-level packaging (PLP) on the 670 mm bed. In its femtosecond configuration that means an NIR, green, or UV ultrashort-pulse source, scanner-based delivery, automated fiducial registration, and Proton λ pulse-on-demand timing. Multi-head and roll-to-roll configurations for volume are engineered as custom equipment.
Process development and pilot production in the PhotonX lab and on the LasX floor — feasibility coupons through qualified pilot lots — while your packaging roadmap and volumes settle. Parameters transfer to a machine of your own when they are ready.
Semiconductor production runs on converted consumables — tapes, films, thermal and shielding parts — as much as on wafers. Converting those is what LasX does at volume.
LasX builds the scanner-based ultrashort-pulse machine tools that sit alongside lithography — and, before that, proves the process on your substrate on our floor. The glass and wafer processes on this page are in development in the PhotonX lab.
We cut and kiss-cut adhesive-coated films and multilayer tape constructions roll-to-roll, as equipment or as contract manufacturing. Whether a given construction meets your edge, cleanliness and dimensional specification is answered by a trial on your material, not a datasheet. Send the material.
We build scanner-based laser machine tools and develop the processes that run on them. The work starts after the fab — vias, scribes, singulation, thin-film patterning, and interposer cutting in back-end and advanced packaging — where a focused ultrashort-pulse beam is the right tool.
Glass (borosilicate and soda-lime), silicon, silicon carbide, gallium nitride, sapphire, technical ceramics, polyimide and other polymer interposers, and thin metal films on dielectrics. Whether a given construction meets a given specification is answered by a trial, not a datasheet — send the material.
Scanner-based delivery with pulse-on-demand timing keeps energy per pulse constant through the scan, and vision registration holds the via field to fiducials across the panel. Throughput and via geometry are coupled; a trial on your glass thickness establishes both before a machine is quoted.
Trials in the PhotonX lab come back as processed samples and a written report — not a proposal.
