Industry
LasX develops scanner-based ultrashort-pulse laser processes for semiconductor back-end and advanced packaging — through-glass vias and glass-core substrate drilling, scribing and singulation of glass, silicon, SiC, and GaN, and selective ablation of thin films on dielectrics — and builds the femtosecond workstations and multi-head machines that run them. We are a laser process and machine-tool company, not a lithography supplier; the work starts where the wafer or panel leaves the fab and needs a hole, a scribe, or a pattern that a saw or a mask cannot make.
Applications
300 µm vias on a 450 µm pitch, laser-drilled in glass in the PhotonX lab (2026). Diameter and pitch hold within a few microns of nominal; taper and sidewall condition are the development targets. Feature metrology comes in a written report.
Scribing and singulation of glass, silicon, SiC and GaN. Ultrashort pulses keep the heat-affected zone and micro-cracking down.
Patterns in thin films on dielectrics that a saw or a mask cannot make.
Chiplets, high-bandwidth memory, and 3D heterogeneous integration are moving substrates to glass and to thicker panels. Through-glass vias, glass-core drilling, and crack-free singulation are laser jobs — scanner-based femtosecond jobs — and they sit alongside lithography, not in place of it.
A femtosecond pulse removes material before heat spreads, which is what keeps the heat-affected zone and micro-cracking down in glass, SiC, and GaN. Proton λ controls pulse output at 10 ns timing resolution, and pulse-on-demand is designed to hold pitch and energy through acceleration and micro-vectors; achieved placement is measured on the substrate in the trial.
Wavelength, burst regime, fluence, and scan strategy are chosen on your actual material in the PhotonX lab, with feature metrology and HAZ characterization in a written report. The trial produces the starting recipe and process record for the workstation you buy, or for our floor while your volumes grow.
ExactPro runs wafer, panel, and substrate work — wafers to 300 mm and 310 mm panel-level packages, with 510 × 515 mm glass interposer and 600 × 600 mm PLP on the 670 mm bed. In its femtosecond configuration that means an NIR, green, or UV ultrashort-pulse source, scanner-based delivery, automated fiducial registration, and Proton λ pulse-on-demand timing. Multi-head and roll-to-roll configurations for volume are engineered as custom equipment.
Process development and pilot production in the PhotonX lab and on the LasX floor — feasibility coupons through qualified pilot lots — while your packaging roadmap and volumes settle. Parameters transfer to a machine of your own when they are ready.
The semiconductor industry's laser conversation has moved from "specialized tool" to "fundamental step" in a few years, and the reason is packaging. Once the substrate is glass and the stack is three-dimensional, the features that connect it are made by a beam.
LasX does not make lithography tools and does not intend to. What we make is the scanner-based ultrashort-pulse machine tool that sits next to them — and, before that, the process that proves your substrate on our floor first.
No. We build scanner-based laser machine tools and develop the processes that run on them. The work starts after the fab — vias, scribes, singulation, thin-film patterning, and interposer cutting in back-end and advanced packaging — where a focused ultrashort-pulse beam is the right tool.
Glass (borosilicate and soda-lime), silicon, silicon carbide, gallium nitride, sapphire, technical ceramics, polyimide and other polymer interposers, and thin metal films on dielectrics. Whether a given construction meets a given specification is answered by a trial, not a datasheet — send the material.
Scanner-based delivery with pulse-on-demand timing keeps energy per pulse constant through the scan, and vision registration holds the via field to fiducials across the panel. Throughput and via geometry are coupled; a trial on your glass thickness establishes both before a machine is quoted.
Trials in the PhotonX lab come back as processed samples and a written report — not a proposal.
