Semiconductors & Advanced Packaging — Equipment
Laser equipment for Semiconductors & Advanced Packaging
Buy the equipment
LaserSharp® Modules and MicroLam™ cut and kiss-cut tapes, films and adhesive stacks on a moving web, with no die to buy, store or wear out. ExactPro runs wafer, panel, and substrate work — wafers to 300 mm and 310 mm panel-level packages, with 510 × 515 mm glass interposer and 600 × 600 mm panel-level packaging (PLP) on the 670 mm bed. In its femtosecond configuration that means an NIR, green, or UV ultrashort-pulse source, scanner-based delivery, automated fiducial registration, and Proton λ pulse-on-demand timing. Multi-head and roll-to-roll configurations for volume are engineered as custom equipment.
Equipment for this work
LaserSharp Module
The patented laser processing modules that power every LasX platform — matched to the material and process, sharing one control and software architecture — and drop into converting lines LasX did not build.
MicroLam
Narrow-web roll-to-roll laser converting on a 100 mm or 350 mm web — a compact cantilever platform with hand-loaded rolls, one to three LaserSharp® Modules configured to the job, and precision lamination as an option.
ExactPro
Laser micromachining on a square bed — 310 × 310 mm or 670 × 670 mm — with automated and vision registration, self-calibration, and a cleanroom configuration all standard.
What it changes
- No die cost, no die lead time, a part change is a file change
- Kiss-cut depth held digitally on release-lined stock
- Controller output timing resolution of 10 ns; individual pulse control at up to 10 MHz. Optical pulse placement depends on the source, scanner, and process configuration
- Registration to fiducials with X/Y/θ and four-point distortion correction
- XY-stage processing of multi-feature panels, registered sheet by sheet
- Wavelength and burst regime chosen for the substrate, proven in the lab before the build
How we de-risk this before you commit
- Feature metrology and heat-affected zone (HAZ) characterization reported per trial
- Process data captured per lot for qualification packages
- Cleanroom-compatible workstation configurations
Questions we get asked
Do you cut dicing tape, back-grind tape and die attach film?
We cut and kiss-cut adhesive-coated films and multilayer tape constructions roll-to-roll, as equipment or as contract manufacturing. Whether a given construction meets your edge, cleanliness and dimensional specification is answered by a trial on your material, not a datasheet. Send the material.
Where in semiconductor production does LasX work?
We build scanner-based laser machine tools and develop the processes that run on them. The work starts after the fab — vias, scribes, singulation, thin-film patterning, and interposer cutting in back-end and advanced packaging — where a focused ultrashort-pulse beam is the right tool.
Which substrates have you processed?
Glass (borosilicate and soda-lime), silicon, silicon carbide, gallium nitride, sapphire, technical ceramics, polyimide and other polymer interposers, and thin metal films on dielectrics. Whether a given construction meets a given specification is answered by a trial, not a datasheet — send the material.
How do you handle through-glass vias at volume?
Scanner-based delivery with pulse-on-demand timing keeps energy per pulse constant through the scan, and vision registration holds the via field to fiducials across the panel. Throughput and via geometry are coupled; a trial on your glass thickness establishes both before a machine is quoted.