Semiconductors & Advanced Packaging — Contract Manufacturing
Contract laser manufacturing for Semiconductors & Advanced Packaging
Have us make the parts
Process development and pilot production in the PhotonX lab and on the LasX floor — feasibility coupons through qualified pilot lots — while your packaging roadmap and volumes settle. Parameters transfer to a machine of your own when they are ready.
What we run
Process tape, die attach film and adhesive film cutting and kiss-cutting
Thermal interface and electromagnetic interference (EMI) shielding parts
Polymer interposer and film cutting
Through-glass via drilling (development)
Scribing and singulation of glass, silicon, silicon carbide (SiC), gallium nitride (GaN) and sapphire (development)
Selective thin-film and metallization ablation on dielectrics
Pilot lots with process data for qualification
What it changes
- A written process report — parameters, feature metrology, edge and heat-affected zone (HAZ) characterization
- Pilot production without capital until volumes justify a machine
- A recipe that moves with you to a workstation on your floor
How we de-risk this before you commit
- Feature metrology and HAZ characterization reported per trial
- Process data captured per lot for qualification packages
- Cleanroom-compatible workstation configurations
Questions we get asked
Do you cut dicing tape, back-grind tape and die attach film?
We cut and kiss-cut adhesive-coated films and multilayer tape constructions roll-to-roll, as equipment or as contract manufacturing. Whether a given construction meets your edge, cleanliness and dimensional specification is answered by a trial on your material, not a datasheet. Send the material.
Where in semiconductor production does LasX work?
We build scanner-based laser machine tools and develop the processes that run on them. The work starts after the fab — vias, scribes, singulation, thin-film patterning, and interposer cutting in back-end and advanced packaging — where a focused ultrashort-pulse beam is the right tool.
Which substrates have you processed?
Glass (borosilicate and soda-lime), silicon, silicon carbide, gallium nitride, sapphire, technical ceramics, polyimide and other polymer interposers, and thin metal films on dielectrics. Whether a given construction meets a given specification is answered by a trial, not a datasheet — send the material.
How do you handle through-glass vias at volume?
Scanner-based delivery with pulse-on-demand timing keeps energy per pulse constant through the scan, and vision registration holds the via field to fiducials across the panel. Throughput and via geometry are coupled; a trial on your glass thickness establishes both before a machine is quoted.