Gaskets & Adhesives — Equipment
Laser equipment for Gaskets & Adhesives
Buy the equipment
LaserSharp® modules cut compressible and adhesive-coated materials without the crush, tooling wear, and die-change downtime that mechanical cutting imposes.
Equipment for this work
LaserSharp LPM
The patented laser processing modules that power every LasX platform — matched to the material and process, sharing one control and software architecture — and drop into converting lines LasX did not build.
SheetPro
Large-format laser processing of sheets, boards, and plates on a static bed — 800 × 1,000 mm, 4 × 8 ft, or 5 × 12 ft — with a LaserSharp® LPM travelling overhead on an XY gantry.
What it changes
- No die cost, no die storage, no die lead time
- Compressible materials cut without crush distortion
- Kiss-cut depth controlled digitally
How we de-risk this before you commit
- Sample parts from your material before commitment
Questions we get asked
How do you control kiss-cut depth on release-lined stock?
Depth is a function of power, speed, and the absorption difference between the adhesive stack and the liner. The laser holds that depth digitally, so it does not drift the way a rotary die does as the blade wears. We establish it per material construction.
Can a laser cut what our die can't?
Often — it's the most common reason a die cutter sends us a job — small holes that lift off the liner, adhesives that load the die, inside cuts too intricate to strip. Minimum features run to 25 µm on laminates with NIR, green or UV sources and 50 µm in CO₂ production; on adhesives and foam, the trial sets the limit.