Security & ID — Contract Manufacturing
Contract laser manufacturing for Security & ID
Have us make the parts
Contract laser processing of card and document material — window cut-outs, inlay processing, perforating and singulation — from development quantities through pilot runs, on the same equipment we sell.
What we run
Window and aperture cutting in card laminate
Inlay and antenna processing
Document perforating and card singulation
What it changes
- Prove a construction before committing to a machine
- Run a format that does not justify its own tooling
How we de-risk this before you commit
- Edge condition and registration documented per trial, on your own card construction
Questions we get asked
Can you cut a card construction you have not run before?
That is the normal case. Laser source, power and parameters are established on your own laminate in the lab before anyone quotes a machine — edge condition, registration and any effect on embedded layers are measured on your material, not inferred from someone else's.
What happens to formats we run only occasionally?
They stop being a tooling decision. With no die to cut, hold and maintain per format, a short run costs its material and its machine time rather than its tooling — which is what usually makes low-volume credential work uneconomic.